Grinding method using grinding system and grinding device

ABSTRACT

The disclosure discloses a grinding method using a grinding device, and a grinding device. The disclosure provides a grinding method using a grinding device, where the method includes: moving a grinding wheel toward a sample stage, and recording a position of the grinding wheel when the bottom of a grinding groove comes into contact with a piece to be ground as a standard position; moving the grinding wheel toward a position detector, and recording a position of the grinding wheel when a position of the bottom of the grinding groove coincides with a detecting center of the position detector as a first reference position; moving the grinding wheel back to the standard position, and grinding the piece to be ground, according to a preset grinding amount using the grinding wheel; and adjusting the position of the grinding wheel.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority of Chinese Patent Application No.201910006892.9, filed with the Chinese Patent Office on Jan. 4, 2019,the content of which is hereby incorporated by reference in itsentirety.

FIELD

The present disclosure relates to the field of fabricating a displaypanel, and particularly to a grinding method using a grinding device,and a grinding device.

BACKGROUND

A display panel, which is an important component of a display device,has been widely applied to a computer, a TV set, a mobile device, etc.In a flow of fabricating the display panel, a cutting process, and edgegrinding and corner rounding process subsequent to the cutting processare indispensable, where the cutting process is typically performedusing a grinding machine.

SUMMARY

In an aspect of the disclosure, embodiments of the disclosure provide agrinding method using a grinding device. In the embodiments of thedisclosure, the grinding device includes: a grinding wheel including agrinding groove around tan outer edge of the grinding wheel, where thegrinding wheel is configured to rotate around a rotation shaft forgrinding; a sample stage on one side of the rotation shaft for placingthereon a piece to be ground; and a position detector configured todetect ta position of a bottom of the grinding groove; and the methodincludes: moving the grinding wheel toward the sample stage, andrecording a position of the grinding wheel when the bottom of thegrinding groove comes into contact with the piece to be ground as astandard position; moving the grinding wheel toward the positiondetector, and recording a position of the grinding wheel when a positionof the bottom of the grinding groove coincides with a detecting centerof the position detector as a first reference position; moving thegrinding wheel back to the standard position, and grinding the piece tobe ground, according to a preset grinding amount using the grindingwheel; and adjusting the position of the grinding wheel by: moving thegrinding wheel again toward the position detector, recording a positionof the grinding wheel when a position of the bottom of the grindinggroove coincides with the detecting center of the position detector as asecond reference position, and adjusting the standard position basedupon the first reference position and the second reference position tothereby determine the position of the grinding wheel.

In the embodiments of the disclosure, the method further includes:adjusting the position of the grinding wheel after one piece to beground is ground using the grinding wheel. In this way, the adjustmentabove for the position of the grinding wheel can be performedautomatically every time a piece to be ground is ground using thegrinding wheel.

In the embodiments of the disclosure, the method further includes:adjusting the position of the grinding wheel after the grinding wheel isreplaced, or the grinding groove is switched. With this method, afterthe grinding wheel is replaced or the grinding groove is switched, theoperating position of the replaced grinding wheel or the switchedgrinding groove can be adjusted based upon the standard position of thegrinding wheel, and the first reference position.

In the embodiments of the disclosure, the method further includes:moving the grinding wheel in a first direction; wherein the firstdirection is perpendicular to the rotation shaft, and a detectingdirection of the position detector is perpendicular to a plane definedby the rotation shaft and the first direction. In this way, the grindingwheel moves in the first direction so that the piece to be ground, onthe sample stage can be aligned with the grinding groove, and theposition detector can be aligned with the bottom of the grinding groove.

In the embodiments of the disclosure, the method further includes: thegrinding device further includes a grinding groove abrasion detectorconfigured to determine an abrasion condition of the grinding groove byobserving the bottom of the grinding groove; and after the piece to beground is ground using the grinding wheel, the method further includes:detecting the abrasion condition of the grinding groove using thegrinding groove abrasion detector; and determining whether to switch thegrinding groove, or to replace the grinding wheel, according to theabrasion condition of the grinding groove, and adjusting the position ofthe grinding wheel after switching the grinding groove or replacing thegrinding wheel.

In the embodiments of the disclosure, the method further includes: thestandard position is determined by: moving the grinding wheel to aposition that an outer edge of the grinding groove comes into contactwith an edge of the sample stage, and recording the position of thegrinding wheel as a first position; firstly moving the grinding wheelfrom the first position by a distance X₀ away from the piece to beground, in the first direction, and then placing the piece to be ground,on the sample stage, wherein an edge of the piece to be ground,protrudes by the distance X₀ beyond the edge of the sample stage towardthe grinding wheel; presetting a standard value of grinding amount X₁ ofthe piece to be ground, in the first direction, and moving the grindingwheel by the standard value X₁ toward the piece to be ground, in thefirst direction; moving the grinding wheel by a value X₂ toward thepiece to be ground, wherein X₂ is a value of a depth by which thegrinding groove is recessed in the first direction; and placing thepiece to be ground, on the sample stage, and adjusting the position ofthe grinding wheel based a positional displacement X₃ of the piece to beground, in the first direction. In the embodiments of the disclosure,the positional displacement X₃ is determined by correcting a position ofthe piece to be ground, which is placed on the sample stage, anddetermining a difference between the position of the placed piece to beground and a preset position of the piece to be ground as the positionaldisplacement X₃. In this method, this method can correct an error ofaligning the piece to be ground with the grinding groove.

In the embodiments of the disclosure, the method further includes: theposition of the grinding wheel includes a positional coordinate X in thefirst direction, and a positional coordinate Z in a second direction,where the first direction is perpendicular to the second direction, therotation shaft extends in the second direction, and when the position ofthe grinding wheel is adjusted, where a difference between the secondreference position and the first reference position is a referenceposition variation including a first reference position variation X_(m)in the first direction, and, and a second reference position variationZ_(m) in the second direction. In this way, the position of the grindingwheel can be adjusted based upon the first reference position variationX_(m) and the second reference position variation Z_(m).

In the embodiments of the disclosure, the adjusting the position of thegrinding wheel further includes: moving the grinding wheel to thestandard position; and moving the grinding wheel from the standardposition by the distance X_(m) in the first direction, and moving thegrinding wheel from the standard position by the distance Z_(m) in thesecond direction. In this way, the variation of the real operatingposition of the grinding wheel can be determined based upon thevariation between the positions of the grinding wheel before and afterit is adjusted, when the position of the bottom of the grinding groovecoincides with the position detector, and the reference positionvariation is substantially the same as the variation of the realoperating position.

In the embodiments of the disclosure, the distance X₀ by which the edgeof the piece to be ground protrudes beyond the edge of the sample stageis from 6 mm to 15 mm. In this way, the position of the grinding wheelcan be adjusted directly according to the distance X0 while the piece tobe ground is being aligned with the grinding wheel.

In another aspect of the disclosure, embodiments of the disclosureprovide a grinding device. In the embodiments of the disclosure, thegrinding device comprises: a grinding wheel comprising a grinding groovearound an outer edge of the grinding wheel, wherein the grinding wheelis configured to rotate around a rotation shaft for grinding; a samplestage on one side of the rotation shaft for placing thereon a piece tobe ground; and a position detector configured to detect a position of abottom of the grinding groove; the display grinding device furthercomprises at least one processor and a memory, wherein the memory isconfigured to store readable program codes, and the at least oneprocessor is configured to execute the readable program codes to:

move the grinding wheel toward the sample stage, and record a positionof the grinding wheel when the bottom of the grinding groove comes intocontact with the piece to be ground as a standard position;

move the grinding wheel toward the position detector, and record aposition of the grinding wheel when a position of the bottom of thegrinding groove coincides with a detecting center of the positiondetector as a first reference position;

move the grinding wheel back to the standard position, and grind thepiece to be ground, according to a preset grinding amount using thegrinding wheel; and

adjust the position of the grinding wheel by: move the grinding wheelagain toward the position detector, record a position of the grindingwheel when a position of the bottom of the grinding groove coincideswith the detecting center of the position detector as a second referenceposition, and adjust the standard position based upon the firstreference position and the second reference position to therebydetermine a position of the grinding wheel.

In the embodiments of the disclosure, the at least one processor isfurther configured to execute the readable program codes to:

adjust the position of the grinding wheel after one piece to be groundis ground using the grinding wheel.

In the embodiments of the disclosure, the at least one processor isfurther configured to execute the readable program codes to:

adjust the position of the grinding wheel after the grinding wheel isreplaced, or the grinding groove is switched.

In the embodiments of the disclosure, the at least one processor isfurther configured to execute the readable program codes to:

move the grinding wheel in a first direction;

wherein the first direction is perpendicular to the rotation shaft, anda detecting direction of the position detector is perpendicular to aplane defined by the rotation shaft and the first direction;

and wherein the position of the grinding wheel comprises a positionalcoordinate X in the first direction, and a positional coordinate Z in asecond direction, wherein the first direction is perpendicular to thesecond direction, the rotation shaft extends in the second direction,and when the position of the grinding wheel is adjusted, a differencebetween the second reference position and the first reference positionis a reference position variation comprising a first reference positionvariation Xm in the first direction, and, and a second referenceposition variation Zm in the second direction.

In the embodiments of the disclosure, the grinding device furthercomprises a grinding groove abrasion detector configured to determine anabrasion condition of the grinding groove by observing the bottom of thegrinding groove; and

after the piece to be ground is ground using the grinding wheel, the atleast one processor is further configured to execute the readableprogram codes to:

detect the abrasion condition of the grinding groove using the grindinggroove abrasion detector;

determine whether to switch the grinding groove, or to replace thegrinding wheel, according to the abrasion condition of the grindinggroove; and

adjust the position of the grinding wheel after switching the grindinggroove or replacing the grinding wheel.

In the embodiments of the disclosure, the at least one processor isfurther configured to execute the readable program codes to:

move the grinding wheel to a position that an outer edge of the grindinggroove comes into contact with an edge of the sample stage, andrecording the position of the grinding wheel as a first position;

firstly move the grinding wheel from the first position by a distance X0away from the piece to be ground, in the first direction, and then placethe piece to be ground, on the sample stage, wherein an edge of thepiece to be ground, protrudes by the distance X0 beyond the edge of thesample stage toward the grinding wheel;

preset a standard value of grinding amount X1 of the piece to be ground,in the first direction, and move the grinding wheel by the standardvalue X1 toward the piece to be ground, in the first direction;

move the grinding wheel by a value X2 toward the piece to be ground,wherein X2 is a value of a depth by which the grinding groove isrecessed in the first direction; and

place the piece to be ground, on the sample stage, and adjust theposition of the grinding wheel based a positional displacement X3 of thepiece to be ground, in the first direction.

In the embodiments of the disclosure, the at least one processor isfurther configured to execute the readable program codes to:

correct a position of the piece to be ground, which is placed on thesample stage, and determine a difference between the position of theplaced piece to be ground and a preset position of the piece to beground as the positional displacement X3. In the embodiments of thedisclosure,

In the embodiments of the disclosure, the at least one processor isfurther configured to execute the readable program codes to:

move the grinding wheel to the standard position; and

move the grinding wheel from the standard position by the distance Xm inthe first direction, and move the grinding wheel from the standardposition by the distance Zm in the second direction.

In the embodiments of the disclosure, the at least one processor isfurther configured to execute the readable program codes to controlthat:

the distance X0 by which the edge of the piece to be ground protrudesbeyond the edge of the sample stage is from 6 mm to 15 mm.

The grinding device can perform the method according to any one of theembodiments above of the disclosure. Accordingly this grinding devicehas all the features of the grinding method using a grinding deviceaccording to the embodiments above of the disclosure.

In a still another aspect of the disclosure, embodiments of thedisclosure provides a grinding device. In the embodiments of thedisclosure, the grinding device includes: a grinding wheel including agrinding groove around the outer edge of the grinding wheel, where thegrinding wheel is configured to rotate around the rotation shaft forgrinding; a sample stage on one side of the rotation shaft for placingthereon a piece to be ground; a position detector configured to detectthe position of the bottom of the grinding groove; and a positionadjustor configured to adjust the position of the grinding wheel usingthe method according to any one of the embodiments above of thedisclosure. Accordingly this grinding device has all the features of thegrinding method using a grinding device according to the embodimentsabove of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and/or other aspects and advantages of the disclosure willbecome apparent and readily understood from the following description ofthe embodiments thereof with reference to the drawings.

FIG. 1 illustrates a first schematic structural diagram of a grindingdevice according to embodiments of the disclosure.

FIG. 2 illustrates a second schematic structural diagram of a grindingdevice according to the embodiments of the disclosure.

FIG. 3 illustrates a third schematic structural diagram of a grindingdevice according to the embodiments of the disclosure.

FIG. 4 illustrates a fourth schematic structural diagram of a grindingdevice according to the embodiments of the disclosure.

FIG. 5 illustrates a first flow chart of a grinding method using agrinding device according to the embodiments of the disclosure.

FIG. 6 illustrates a second flow chart of a grinding method using agrinding device according to the embodiments of the disclosure.

FIG. 7 illustrates a third flow chart of a grinding method using agrinding device according to the embodiments of the disclosure.

FIG. 8A to FIG. 8C illustrates a fourth flow chart of a grinding methodusing a grinding device according to the embodiments of the disclosure;

FIG. 9A to FIG. 9B illustrates a fifth flow chart of a grinding methodusing a grinding device according to the embodiments of the disclosure.

FIG. 10 illustrates a sixth flow chart of a grinding method using agrinding device according to the embodiments of the disclosure.

FIG. 11 illustrates a seventh flow chart of a grinding method using agrinding device according to the embodiments of the disclosure.

DETAILED DESCRIPTION OF THE EMBODIMENTS

An Organic Light-Emitting Diode (OLED) display panel (an OELD substrate)is fabricated by cutting a large-size OLED substrate fabricated in anarray substrate into two or four OLED substrates. At present, thelarge-size OLED substrate is typically cut through laser cutting, wherethe quality of laser cutting can be guaranteed without generating anyparticles. However there may be a small area of micro cracks around acut edge due to the effect of thermal expansion and contraction, a sharpangle at the cut edge, and a stress concentrated at the cut edge as aresult of laser cutting. Accordingly the cut edge shall be ground in agrinding process to thereby remove the micro cracks, the stress, andother process defects.

However it is still desirable to improve the grinding methods using agrinding device, and the grinding devices in the related art.

The existing grinding methods using a grinding device generally sufferfrom an unstable quality of grinding, a short service lifetime of agrinding wheel, a long period of time for replacing a grinding wheel ina complex flow, a low activation ratio, etc. A piece to be ground (e.g.,an OLED substrate) is currently ground using a grinding wheel by firstlyaligning the piece to be ground, precisely with a grinding groove of thegrinding wheel to thereby determine the start position of grinding, andan grinding amount, and then grinding the piece. Since a display panel(e.g., an OLED substrate) is to be ground according to a small grindingamount (typically at a micrometer order), the piece to be ground shallbe both aligned precisely with the grinding groove, and ground preciselyin the grinding process.

However there is an error of the mechanical precision of the grindingwheel and each grinding groove, and for example, there is aninsignificant difference between the depths by which the respectivegrinding grooves are recessed, there is also an insignificant differencein installation position of the grinding wheel each time it is replaced,etc., so if the piece is ground directly at the original positionwithout being aligned again each time the grinding groove is switched orthe grinding wheel is replaced, then the real contact position of thegrinding groove with the piece to be initially ground will not bedeterminate, that is, a real grinding amount may be more than or lessthan a preset grinding amount, thus resulting in a sparkle, chipping, acrack, particles, a fragment, or another product defect, for example;and if the real grinding amount is too large, then a diamond cutter inthe grinding groove may fall off due to excessive grinding, the edge ofthe diamond cutter may be easily blocked by melt glass, and thuspassivated, due to excessive grinding, etc., thus shortening the servicelifetimes of the grinding groove and the grinding wheel. If the grindinggroove or the grinding wheel is debugged each time the grinding grooveis switched or the grinding wheel is replaced, then it will be verytime-consuming, thus degrading the activation ratio and the productionefficiency of the grounding device. If the grinding wheel is not alignedprecisely in position, then the grinding amount the piece to be groundmay be not precise each time the grinding wheel is replaced, thusconsuming time and wasting a material.

Accordingly, embodiments of the disclosure can significantly address theproblems above if such a new grounding method is provided that canshorten a period of time for switching a grind groove, and a period oftime for replacing a grinding wheel, and can improve the quality of aproduct after grinding, and prolong the service lifetime of the grindingwheel.

The embodiments of the disclosure can alleviate at least to some extent,or address at least one of the problems above.

The embodiments of the disclosure will be described below in details,and examples of the embodiments have been illustrated in the drawings,where identical or like reference numerals refer to identical or likeelements, or elements with identical or like functions throughout thedrawings.

In an aspect of the disclosure, embodiments of the disclosure provide agrinding method using a grinding device. With this method, an operatingposition of a grinding wheel can be determined rapidly and accuratelyafter a grinding wheel is replaced, a grinding groove is switched, orthe grinding wheel is deformed (contracted inward), to thereby improvethe activation ratio of the grinding device, and the quality of a groundproduct, and prolong the service lifetime of the grinding wheel.

For the sake of convenient understanding, firstly a structure of agrinding device according to embodiments of the disclosure will bedescribed below in brevity. As illustrated in FIG. 1, the grindingdevice according to the embodiments of the disclosure includes: agrinding wheel 10, a sample stage 40, and a position detector 50; wherethe grinding wheel 10 includes a grinding groove 20 around an outer edgeof the grinding wheel 10 and a rotation shaft 30 through the center ofthe grinding wheel 10, where the grinding wheel 10 can rotate around therotation shaft 30 for grinding; where the sample stage 40 is on one sideof the rotation shaft 30 for placing thereon a piece to be ground (notillustrated). It shall be noted that FIG. 1 illustrates a schematicstructural diagram of the grinding wheel 10 in a sectional view for thesake of convenient understanding.

In the embodiments of the disclosure, the grinding device can furtherinclude a motor (not illustrated) configured to power the rotation shaft30 to thereby bring the rotation shaft 30 into rotation and further thegrinding wheel 10 into rotation so as to grind the piece to be ground(not illustrated). In some embodiments, one or more grinding grooves 20can be at the outer edge of the grinding wheel 10, and for example, fivegrinding grooves 20 are at the outer edge of the grinding wheel 10 asillustrated in FIG. 1, where the grinding grooves 20 can be arrangedsequentially along the rotation shaft 30 (that is, arranged sequentiallyin the Z direction as illustrated in FIG. 1). The grinding wheel 10 isstructured symmetric about a symmetry axis which is the rotation shaft30, and more particularly the central axis AA′ of the rotation shaft 30.In some embodiments, the grinding wheel 10 can be structured like a diskor a ring, and the grinding groove 20 is structured like a ring aroundthe grinding wheel 10; and an operating state and an abrasion state ofthe same grinding groove 20 at each position remain totally the samethroughout a rotation and grinding process of the grinding wheel 10. Itshall be noted that the grinding groove in the embodiments of thedisclosure is typically structured as an alloy base wrapped with diamonddust or other grinding particles, and in the grinding process, thediamond dust or the other grinding particles come into contact with andgrind the piece to be ground, and the alloy base support the grindingparticles. In the embodiments of the disclosure, the grinding groove iscontracted inward, abraded, deformed, etc., in such a way that after thegrinding groove has operated for a long period of time, the alloy basewrapped with the grinding particles are abraded, damaged etc., so thatthe grinding particles fall off, thus resulting in a poor real grindingeffect, that is, a smaller or larger real grinding amount than a presetgrinding amount, etc., all of which can be referred to as the “grindinggroove is contracted inward, abraded, deformed, etc.”

In some embodiments, the position of the grinding wheel 10 in theembodiments of the disclosure can refer to the position of the center ofthe grinding wheel 10, i.e., the position of the center of the rotationshaft 30, which is the position of the point A as illustrated in FIG. 1.In the embodiments of the disclosure, as illustrated in FIG. 1, theposition of the grinding wheel 10 includes a positional coordinate X inthe first direction (i.e., the X direction as illustrated in FIG. 1),and a positional coordinate Z in the second direction (i.e., the Zdirection as illustrated in FIG. 1), where the first direction isperpendicular to the second direction, the grinding grooves 20 arearranged sequentially in the Z direction, that is, the rotation shaft 30extends in the Z direction, and the grinding wheel can rotate around therotation shaft 30 in the Z direction, and grind the piece to begrounded.

In the embodiments of the disclosure, the shape and the position of thesample stage 40 will not be limited to any particular shape and theposition as long the bottom of the grinding groove 20 (such as twosymmetric points B and B′ at the bottom of the grinding groove 20 asillustrated in FIG. 1) can come into contact in effect with and cangrind the piece to be ground (not illustrated), placed on the samplestage 40.

In the embodiments of the disclosure, the position detector 50 caninclude a Charge Coupled Device (CCD) image sensor (a CCD detector)configured to take an image of an object, and to convert an opticalsignal into an electric signal. In some embodiments, the CCD detector isfixed at some position in the grinding device, and includes a detectingdirection (an image-taking direction) and a detecting area (animage-taking range), that is, the CCD detector can obtain imageinformation of the object only when the object is located in thedetecting area of the CCD detector. Stated otherwise, the position ofthe position detector 50 is fixed, and the CCD detector can obtain animage of the bottom of the grinding groove only after the groundingwheel enters the detecting area (i.e., the image-taking range) of theCCD detector.

In the embodiments of the disclosure, the position of the positiondetector 50 will not be limited to any particular position as long as itcan detect the position of the bottom of the grinding groove 20. In someembodiments, as illustrated in FIG. 1, after the grinding wheel 10 movesto the sample stage 40 in the first direction (i.e., the X direction),the bottom of the grinding groove 20 can come into contact with thepiece to be ground (not illustrated), placed on the sample stage 40, anda standard position of the grinding wheel 10 can be recorded. Therotation shaft 30 of the grinding wheel 10 extends in the seconddirection (i.e., the Z direction), and the detecting direction of theposition detector 50 can be perpendicular to a plane defined by therotation shaft 30 and the first direction (i.e., the X direction), thatis, when the position detector 50 is a CCD detector, a detectingdirection (an image-taking direction) of the CCD detector is a directionperpendicular to the paper. Those skilled in the art can appreciate thatthe grinding wheel 10 needs to be moved in the first direction tothereby enter a detecting area (an image-taking range) of the CCDdetector, so the CCD detector shall be arranged without hindering thegrinding wheel 10 from being moved. Stated otherwise, the position ofthe CCD detector needs to be displaced from the plane defined by therotation shaft 30 and the first direction (i.e., the X direction) bysome distance. Accordingly the grinding wheel 10 is moved in the firstdirection (the X direction) so that the piece to be ground (notillustrated), placed on the sample stage 40 can be aligned with thegrinding groove 20, and the position detector 50 can be aligned with thebottom of the grinding groove 20 (that is, the grinding wheel 10 ismoved in the first direction (the X direction) so that the bottom of thegrinding groove 20 can be moved into the detecting area of the positiondetector 50, so the position detector 50 can obtain image informationand positional information of the bottom of the grinding groove 20),thus simplifying the operations, avoiding an error from occurring afterthe grinding wheel 10 has been moved repeatedly in a plurality ofdirections, and improving the precision of alignment, and the precisionof grinding.

In some embodiments, as illustrated in FIG. 1, while the grinding wheel10 is moved to the side proximate to the position detector 50 in the Xdirection, the outer edge of the grinding wheel 10 can firstly enter thedetecting area of the position detector 50 so that the position detector50 can firstly obtain an image and the position of the outer edge of thegrinding wheel 10; and thereafter the grinding wheel 10 can further bemoved to the side proximate to the position detector 50 in the Xdirection until the position of the bottom of the grinding groove (e.g.,the point B′ as illustrated) coincides with the center of the detectingarea (as illustrated in FIG. 2), and the position of the grinding wheel10 at this time is the reference position of the grinding wheel 10 (afirst reference position or a second reference position). It shall benoted that “the position of the bottom of the grinding groove coincideswith the detecting center of the position detector” as described hereinrefers to that the bottom of the grinding groove coincides with thecenter of the detecting area of the position detector. For example, whenthe position detector is a CCD detector, the center of the detectingarea can be the center of an image-taking interface of the CCD detector.

In the embodiments of the disclosure, as illustrated in FIG. 2 and FIG.3 (which illustrate schematic structural diagrams of the grinding devicewhen the grinding wheel 10 is moved until the bottom of the grindinggroove coincides with the detecting center of the position detector), aprojection of the position detector 50 onto a plane defined by therotation shaft 30 and the first direction (i.e., the X direction) (i.e.,a projection thereof onto the paper) can lie between the sample stage 40and the grinding wheel 10 (as illustrated in FIG. 3), or can lie on theside of the sample stage 40 away from the grinding wheel 10 (notillustrated), or can lie on the side of the grinding wheel 10 away fromthe sample stage 40 (as illustrated in FIG. 2), thus making itconvenient for the grinding wheel 10 to be moved in the first direction,and to be located in the detecting area of the position detector 50. Insome embodiments, as illustrated in FIG. 3, when the projection of theposition detector 50 onto the plane defined by the rotation shaft 30 andthe first direction (i.e., the X direction) lies between the samplestage 40 and the grinding wheel 10, the grinding wheel 10 is moved sothat the bottom (i.e., the point B as illustrated) of the grindinggroove on the side of the grinding wheel 10 proximate to the samplestage 40 can simply coincide with the center of the detecting area ofthe position detector 50. In some embodiments, when the positiondetector 50 is on the side of the sample stage 40 away from the grindingwheel 10, firstly the sample stage 40 can be moved in the directionperpendicular to the paper and away from the position detector 50, andthen the grinding wheel 10 can be moved toward the position detector 50in the first direction, so that the bottom (i.e., the point B asillustrated) of the grinding groove on the side of the grinding wheel 10proximate to the sample stage 40 can also coincide with the center ofthe detecting area of the position detector 50. In some embodiments, asillustrated in FIG. 2, the projection of the position detector 50 ontothe plane defined by the rotation shaft 30 and the first direction(i.e., the X direction) lies on the side of the grinding wheel 10 awayfrom the sample stage 40, and the grinding wheel 10 is moved so that thebottom (i.e., the point B′ as illustrated) of the grinding groove on theside of the grinding wheel 10 away from the sample stage 40 can simplycoincide with the center of the detecting area of the position detector50.

As described above, the existing grinding methods using a grindingdevice generally suffer from an unstable quality of grinding, a shortservice lifetime of a grinding wheel, a long period of time forreplacing a grinding wheel in a complex flow, a low activation ratio,etc.

In the method according to the embodiments of the disclosure, after thegrinding wheel is debugged, and before the piece to be ground is ground,firstly the operating position of the debugged grinding wheel (i.e., thestandard position of the grinding wheel when the bottom of the grindinggroove comes into contact with the piece to be ground) is recorded, andthen the grinding wheel is moved to such a position that the bottom ofthe grinding groove coincides with the detecting center of the positiondetector, the first reference position of the grinding wheel isrecorded, and then the piece to be grounded is ground. Thereafter afterthe grinding wheel has operated for a period of time, or the grindinggroove is switched, or the grinding wheel is replaced, firstly theoperating grinding wheel or the replaced grinding wheel (grindinggroove) moves to such a position that the bottom of the grinding groovecoincides with the detecting center of the position detector, the secondreference position of the grinding wheel is recorded, and the standardposition of the grinding wheel is adjusted based upon the firstreference position and the second reference position to therebydetermine a position of the grinding wheel again.

Stated otherwise, in this method, the operating position of the grindingwheel debugged in advance is recorded (to thereby obtain the standardposition), and the detection position of the debugged grinding wheel isdetermined smartly by the position detector (to thereby obtain the firstreference position), so that the operating position of the grindingwheel can be associated with the detection position thereof, and theoperating position can be determined with reference to the detectionposition. After the grinding wheel (the grinding groove) is replaced, orthe grinding wheel which has operated for a period of time is deformed,firstly the replaced or deformed grinding wheel (grinding groove) can bemoved to the detection position of the grinding wheel (to thereby obtainthe second reference position), and the variation of the operatingposition of the grinding wheel relative to the standard position can beconcluded based upon the change in detection position of the grindingwheel, so that the operating position of the grinding wheel can beadjusted simply and rapidly, that is, firstly the grinding wheel can bemoved to the standard position recorded in the previous step, and thenthe grinding wheel can be further finely adjusted according to thechange in reference position, so that the real operating position of thegrinding wheel can be determined. Accordingly this method has theadvantages of being simple, rapid, and accurate over the existing methodin which the piece to be grounded is grounded directly by the grindingwheel after the grinding wheel is replaced, or the grinding wheel isdebugged in a complex process after the grinding wheel is replaced, sothis method can simplify the flow of replacing the grinding wheel,shorten a period of time for replacing the grinding wheel, and improvethe activation ratio and the production efficiency of the groundingdevice, and this method can improve the quality of grinding, and avoidthe service lifetime of the grinding wheel from being shortened due toexcessive grounding in reality.

In the embodiments of the disclosure, the grinding device can furtherinclude a grinding groove abrasion detector configured to determine anabrasion condition of the grinding groove by observing the bottom of thegrinding groove. In some embodiments, the grinding groove abrasiondetector 70 can also be a Charge Coupled Device (CCD) image sensor (aCCD detector). In some embodiments, the position of the grinding grooveabrasion detector will not be limited to any particular position as longas it can detect the abrasion condition of the bottom of the grindinggroove accurately. In some embodiments, as illustrated in FIG. 4, thegrinding groove abrasion detector 70 can also be arranged in the firstdirection (the X direction), and a detecting direction of the grindinggroove abrasion detector 70 (the direction of the arrow M asillustrated) faces the bottom of the grinding groove 20, so the grindinggroove abrasion detector 70 can take a clear image of the bottom of thegrinding groove 20, and obtain the abrasion condition of the grindinggroove so that it can be subsequently determined whether to replace thegrinding groove, to replace the grinding wheel, etc., according to theabrasion condition of the grinding groove. It shall be noted that thegrinding groove abrasion detector facing the grinding groove can take aclear image of the real operating state and abrasion state of thegrinding wheel. Stated otherwise, the image-taking direction of thegrinding groove abrasion detector 70 can be perpendicular to theimage-taking direction of the position detector 50. The grinding grooveabrasion detector 70 is only responsible for observing the abrasioncondition of the bottom of the grinding groove, the grinding grooveabrasion detector 70 can alternatively be fixed in position as long asit can obtain image information in the direction facing the bottom ofthe grinding groove without hindering the grinding wheel 10 from movingin the first direction.

It shall be noted that all of FIG. 1 to FIG. 4 above illustrateschematic structural diagrams of the grinding wheel 10 in a sectionalview for the sake of convenient understanding.

In summary, in the embodiments of the disclosure, a reference positionwhen the grinding wheel is moved to the position detector is recorded sothat the operating position of the grinding wheel can be determinedsimply and conveniently relative to the standard position, and aftersubsequently the grinding groove is deformed or switched, or thegrinding wheel is replaced, firstly the grinding wheel can be adjustedto a reference position, and then the operating position of the grindingwheel can be determined again simply and conveniently based upon thevariation between the reference positions, so in this method, after thegrinding groove is deformed or switched, or the grinding wheel isreplaced, no complex alignment or calibration process will be performed,and the operating position of the grinding wheel can be determined againrapidly and precisely, thus improving the performance of the grindingwheel in operation.

In the embodiments of the disclosure, as illustrated in FIG. 5 and FIG.6, the method includes the following steps.

Step S110 is to have the bottom of the grinding groove come into contactwith the piece to be grounded, and to record a standard position of thegrinding wheel.

In this step, the grinding wheel is moved toward the sample stage, andthe position of the grinding wheel when the bottom of the grindinggroove comes into contact with the piece to be grounded is recorded asthe standard position. In some embodiments, as illustrated in FIG. 7 andFIG. 8A to 8C, the method further includes the following steps.

Step S10 is to move the grinding wheel to such a position that the outeredge of the grinding groove comes into contact with the edge of thesample stage.

In this step, the grinding wheel is moved to such a position that thefirst side thereof comes into contact with the edge of the sample stage,and this position is recorded as a first position of the grinding wheel.In some embodiments, the shape of the sample stage will not be limitedto any particular shape, and as illustrated in FIG. 9A, for example, thesample stage 40 can include a support plate 41 and a fixing piece 42. Insome embodiments, the piece to be ground (e.g., an OLED substrate notillustrated in FIG. 9A) can be placed between the support plate 41 andthe fixing piece 42, and fixed by the fixing piece 42 to thereby preventthe piece to be ground, from being moved on the sample stage 40. In someembodiments, as illustrated in FIG. 9A, the edge of the sample stage 40can come into contact with the outer edge 21 of the grinding groove 20,and the position of the grinding wheel 10 at this time, i.e., theposition of the point A as illustrated, can be recorded as the firstposition. It shall be noted that as illustrated in FIG. 9A or 9B, the Xdirection is the first direction, and the second direction (the Zdirection) is perpendicular to the first direction, i.e., the directionperpendicular to the paper in FIG. 9A or 9B.

Step S20 is to move the grinding wheel by a distance X₀ away from thepiece to be ground.

In this step, firstly the grinding wheel is moved by the distance X₀from the first position above in the first direction away from the pieceto be ground, and then the piece to be ground is placed on the samplestage, where the edge of the piece to be ground protrudes toward thegrinding wheel by the distance X₀ beyond the edge of the sample stage.In some embodiments, as illustrated in FIG. 8B and FIG. 9B, in order toprotect the sample stage from being damaged by the grinding groovecoming into contact with the piece to be ground and by grinding thepiece to be ground, firstly the piece to be ground 60 shall protrudetoward the grinding wheel 10 by some distance (e.g., the distance X₀)beyond the edge of the sample stage 40, and then the particular grindingamount, etc., will be further adjusted, where the distance X₀ is morethan a preset grinding amount, so the grinding amount will besubsequently adjusted while the piece to be ground 60 is protrudingtoward the grinding wheel 10 by some distance beyond the edge of thesample stage 40 all the time to thereby avoid the grinding wheel 10 fromabrading and damaged the sample stage 40. In some embodiments, thedistance X₀ by which the edge of the piece to be ground 60 protrudesbeyond the edge of the sample stage 40 may be from 6 mm to 15 mm, and insome embodiments, may be 10 mm. Accordingly in this step, the positionof the grounding wheel 10 can be adjusted directly according to therange of the distance X₀, and then the piece to be ground 60 can beadjusted simply and rapidly.

Step S30 is to move the grinding wheel by a standard value of grindingamount X₁ toward the piece to be ground.

In this step, the grinding wheel moves by the standard value of grindingamount X₁ toward the piece to be ground, from the position above in thefirst direction. In some embodiments, the standard value of grindingamount X₁ of the piece to be ground, in the first direction is preset,so the grinding wheel shall move by the standard value X₁ toward thepiece to be ground, in the first direction.

Step S40 is to move the grinding wheel by a value X₂ toward the piece tobe ground.

In this step, the grinding wheel moves by the value X₂ from the positionabove toward the piece to be ground, in the first direction. In someembodiments, as illustrated in FIG. 8C, the depth by which the grindinggroove 20A is recessed in the first direction (the X direction) is thevalue X₂, so the grinding wheel 10 moves by the value X₂ from theposition above toward the piece to be ground 60. It shall be noted thatthe value X₂ of the recessed depth is the vertical distance between thebottom of the grinding groove (the point B as illustrated) to the outeredge 21 of the grinding groove.

Step S50 is to move the grinding wheel by a positional displacement X₃to thereby obtain the standard position of the grinding wheel.

In this step, the grinding wheel is moved by the positional displacementX₃ from the position above in the first direction to thereby obtain thestandard position of the grinding wheel.

In some embodiments, when the piece to be ground is placed on the samplestage in the step above, there is a positional displacement X₃ in thefirst direction, so the positional displacement X₃ shall be compensatedfor. In some embodiments, when the piece to be ground is placed on thesample stage in the step above, the edge of the piece to be ground shallprotrude toward the piece to be ground, by the distance X₀ beyond theedge of the sample stage so that the edge of the piece to be groundexactly comes into contact with the outer edge of the grinding wheel,and the position of the piece to be ground, in the first direction atthis time is a predetermined position of the piece to be ground. Howeverthere may be some displacement when the piece to be ground is reallyplaced on the sample stage, that is, the edge of the really placed pieceto be ground protrudes toward the grinding wheel by another distancethan X₀ beyond the edge of the sample stage. Stated otherwise, there maybe a positional displacement X₃ in the first direction when the piece tobe ground is really placed, that is, there is a distance between thereal position of the placed piece to be ground, and the predeterminedposition of the piece to be ground. In some embodiments, an alignmentmark can be designed in advance on the piece to be ground (e.g., anorganic light-emitting diode display panel), and the grinding devicefurther includes a position detector for a piece to be ground, where theposition detector can be a CCD detector and configured to obtain imageand positional information of the alignment mark on the piece to beground. In some embodiments, the distance (i.e., a reference distance)between the alignment mark on the piece to be ground, and a detectingcenter of the position detector for the piece to be ground when thepiece to be ground is located at the predetermined position can bedetermined in advance, and each time the piece to be ground issubsequently placed on the sample stage, the distance (i.e., a realdistance) between the alignment mark on the piece to be ground, and adetecting center of the position detector for the piece to be ground canbe detected again, the difference between the real distance and thereference distance can be calculated, and the positional displacement X₃in the first direction when the piece to be ground is placed on thesample stage can be determined. Accordingly the grinding wheel moves bythe distance X₃ from the position above in the first direction, wherethe position is the standard position of the grinding wheel. In someembodiments, the positional displacement X₃ can be positive or negative,that is, the position of the piece to be ground, placed on the samplestage may be displaced toward or away from the grinding groove, so thegrinding wheel shall move by X₃ away from or toward the piece to beground, in the first direction as needed in reality.

In summary, this method can align the piece to be ground, precisely withthe grinding groove, and improve the precision of grinding, and thequality of a ground product. Furthermore the position of the grindingwheel can be adjusted by determining the operating position of thegrinding wheel again with reference to the standard position of thegrinding wheel determined in the step above, after the grinding wheel issubsequently deformed or replaced.

The methods further includes step S120, where the step S120 is to havethe bottom of the grinding groove coincide with the detecting center ofthe position detector, and to record a first reference position of thegrinding wheel.

In this step, the grinding wheel is moved from the standard positionadjusted in the step above to such a position that the bottom of thegrinding groove coincides with the detecting center of the positiondetector, and the position of the grinding wheel is recorded as thefirst reference position. In some embodiments, as described above, asillustrated in FIG. 1, the grinding wheel 10 can be moved from thestandard position adjusted in the step above toward the positiondetector 50 side in the X direction, where the outer edge of thegrinding wheel 10 can firstly enter the detecting area of the positiondetector 50 so that the position detector 50 can firstly obtain an imageand the position of the outer edge of the grinding wheel 10, andthereafter the grinding wheel 10 can be further moved toward theposition detector 50 side in the X direction until the position (e.g.,the point B′ as illustrated) of the bottom of the grinding groovecoincides with the center of the detecting area of the position detector50 (as illustrated in FIG. 2), and the position of the grinding wheel 10at this time is the first reference position of the grinding wheel 10.In this way, this method can obtain the first reference position of thegrinding wheel precisely to thereby facilitate subsequent precisionadjustment of the operating position of the grinding wheel so as toimprove the quality of a product ground in this method.

Step S130 is to move the grinding wheel back to the standard position,and to grind the piece to be ground.

In this step, after the first reference position of the grinding wheelis recorded in the step above, the grinding wheel is moved back to thestandard position, and the piece to be ground is ground by the grindingwheel.

In the embodiments of the disclosure, the grinding wheel can be movedautomatically toward the position detector in the grinding process tothereby grind each piece to be ground, that is, the position of thegrinding wheel can be adjusted automatically to thereby grind each pieceto be ground using the grinding wheel, so that the operating position ofthe grinding wheel can be calibrated automatically in a timely manner inthis method to thereby improve the precision of grinding, the quality ofa ground product, and the extent to which the grinding device becomesautomatic. In the embodiments of the disclosure, after the grindinggroove is switched, or the grinding wheel is replaced, the position ofthe grinding wheel can also be adjusted, in the following steps in someembodiments.

Step S200 is to adjust the position of the grinding wheel.

In this step, the position of the grinding wheel is adjusted after apiece to be ground is ground, or the grinding groove is switched, or thegrinding wheel is replaced. In some embodiments, as illustrated in FIG.6, the method further includes the following steps.

Step S210 is to have the bottom of the grinding groove coincide with thedetecting center of the position detector again, and to record a secondreference position of the grinding wheel.

In this step, the bottom of the grinding groove coincides with thedetecting center of the position detector again, and the position of thegrinding wheel is recorded as the second reference position thereof. Insome embodiments, the grinding wheel may be contracted inward after ithas operated for a long period of time, so after each piece to be groundis grounded by the grinding wheel, the bottom of the grinding groove cancoincide with the detecting center of the position detector again, andat this time, if the bottom of the grinding groove is contracted inward,then the position (i.e., the second reference position) of the grindingwheel when the bottom of the grinding groove coincides with thedetecting center of the position detector will be also changed from thefirst reference position recorded in the step above. In someembodiments, after the grinding wheel is replaced, the grinding wheelcan be firstly adjusted to such a position that the bottom of thegrinding groove coincides with the detecting center of the positiondetector, and the position can be recorded as the second referenceposition.

Step S220 is to adjust the standard position, and to determine aposition of the grinding wheel again.

In this step, the standard position of the grinding wheel recorded inthe step above is adjusted based upon the first reference position andthe second reference position recorded in the step above to therebydetermine the position of the grinding wheel again. In some embodiments,firstly the difference between the first reference position and thesecond reference position recorded in the step can be determined as areference position variation, and then the grinding wheel can be movedto the standard position of the grinding wheel recorded in the stepabove, and the position of the grinding wheel can be adjusted accordingto the standard position, and the reference position variation tothereby determine the final operating position of the grinding wheel. Insome embodiments, the reference position variation can include a firstreference position variation X_(m) in the first direction, and, and asecond reference position variation Z_(m) in the second direction. Insome embodiments, the first reference position variation X_(m) may bepositive or negative, and the second reference position variation Z_(m)may also be positive or negative. In the embodiments of the disclosure,when the first reference position variation X_(m) is positive, theoperating position of the grinding wheel can be determined again in sucha way that the grinding wheel is moved from the standard position of thegrinding wheel toward the piece to be ground, in the first direction,and when the first reference position variation X_(m) is negative, theoperating position of the grinding wheel can be determined again in sucha way that the grinding wheel is moved away from the piece to be ground,in the first direction. Alike when the second reference positionvariation Z_(m) is positive, the grinding wheel is moved from thestandard position of the grinding wheel away from the piece to beground, in the second direction, and when the second reference positionvariation Z_(m) is negative, the operating position of the grindingwheel can be determined again in such a way that the grinding wheelmoves toward the piece to be ground, in the second direction. In thisway, the real operating position of the grinding wheel can be adjustedsimply and conveniently according to the reference position variation.

In the embodiments of the disclosure, when the first reference positionvariation in the first determined in the step above is X_(m), asillustrated in FIG. 1, the first reference position variation of theposition (i.e., the position of the point A as illustrated) of thecenter of the rotation shaft 30 of the grinding wheel 10 is X_(m), andthe operating position of the grinding wheel 10 can be subsequentlydetermined again in such a way that firstly the grinding wheel 10 ismoved to the standard position, and since the grinding groove isstructured like a ring around the grinding wheel, and rotating inoperation, the operating state and the abrasion state of the samegrinding wheel at each position remain totally the same, so thereference position variation of the grinding wheel is substantially thesame as the real operating position variation, and the grinding wheelcan be moved from the standard position by the distance X_(m) in thefirst direction so that the operating position of the grinding wheel 10can be determined again. Accordingly in this method, the positiondetector can obtain the position information of any one point at thebottom of the grinding groove, the reference position of the grindingwheel can be obtained based upon the positional information, andsubsequently the amount of abrasion of the grinding wheel, etc., can bedetermined based upon a variation between two reference positions tothereby adjust the operating position of the grinding wheel accurately.

In some embodiments, when the grinding groove is contracted inward by 1μm in the X direction, for example, the position of B or B′ the bottomof the grinding groove coincides with the position detector 50, so thefirst reference position variation X_(m) can be 1 μm, andcorrespondingly the position of the grinding wheel 10 shall bedetermined again by moving the grinding wheel from the standard positiontoward the sample stage 40 by the distance 1 μm to thereby compensatefor the amount of inward contraction of the grinding wheel. In someembodiments, when the second reference position variation in the seconddirection is Z_(m), the grinding wheel can be moved from the standardposition by the distance Z_(m) in the second direction. In this way, thereal operating position variation of the grinding wheel can bedetermined based upon the variation between the positions of thegrinding wheel before and after it is adjusted, when the bottom of thegrinding groove coincides with the detecting center the positiondetector, so that the operating position of the grinding wheel can bedetermined simply, conveniently, rapidly, and precisely.

As described above, the grinding wheel may be deformed, e.g., contractedinward, etc., after it has operated for a period of time, thus resultingin an insufficient real grinding amount (i.e., a lower real grindingamount), and if an error of grinding arising from inward contraction ofthe grinding groove is not compensated for in a timely manner, thenthere will be an instable grinding amount (e.g., a lower grindingamount) of a ground product, thus degrading the quality of the groundproduct. In the method according to the embodiments of the disclosure,the grinding amount of the ground product can be checked automatically,and for example, the shape and the position of the grinding groove canbe validated before each piece to be ground is machined, to therebyensure the grinding groove to be located at a predetermined position ina real grinding process, so as to guarantee the grinding amount of thepiece to be ground. Stated otherwise, each time the grinding wheelgrinds piece to be ground the grinding device can correct and compensatefor the grinding amount automatically, or when the grinding groove iscontracted inward so seriously that the grinding groove shall beswitched, or the grinding wheel shall be replaced, the operatingposition of the grinding wheel can be determined again in the process asdescribed above of adjusting the position of the grinding groove, afterthe grinding groove is switched, or the grinding wheel is replaced. Inthis way, the extent to which the grinding device becomes automatic canbe improved, the precision of grinding can be improved, and the qualityof a ground product can be improved.

In the embodiments of the disclosure, as illustrated in FIG. 10, afterthe grinding wheel has operated for a period of time, the method furtherincludes the following steps.

Step S300 is to detect an abrasion condition of the grinding grooveusing the grinding groove abrasion detector.

In this step, after the piece to be ground has been ground by thegrinding wheel for a period of time, the grinding groove abrasiondetector can check the abrasion condition of the grinding groove. Insome embodiments, as described above, the grinding groove abrasiondetector can also be a Charge Coupled Device (CCD) image sensor (a CCDdetector). In some embodiments, the grinding groove abrasion detectorcan be fixed or movable in the grinding device as long as the grindinggroove abrasion detector can obtain an operating condition of the bottomof the grinding groove (an image of the bottom thereof) accurately,e.g., the extent to which the diamond dust embedded on the alloy basefalls off, to thereby detect the abrasion condition of the grindinggroove, or the fragmentation of the piece to be ground, due to abnormalproduction. In some embodiments, as illustrated in FIG. 4, the grindinggroove abrasion detector 70 can be on the side facing the grinding wheel10 and away from the sample stage 40 to thereby detect the abrasioncondition of the grinding groove, so that the grinding groove abrasiondetector 70 at that position can take a clear image of the bottom of thegrinding groove to thereby obtain the abrasion condition of the grindinggroove.

In some embodiments, while the grinding has been operating for a longperiod of time, the number of pieces to be ground, which have beengrounded by the grinding groove is increasing to some value (e.g., 500)until the service lifetime of the grinding groove expires, so it can bedetermined whether to replace the grinding wheel or to switch thegrinding groove, directly according to the number of pieces to beground, which have been grounded by the grinding groove, or the periodof time for which the grinding groove has operated (e.g., a month). Insome embodiments, after some number of pieces to be grounded have beengrounded by the grinding groove, it can be firstly determined that theservice lifetime of the grinding groove expires, and then the grindinggroove abrasion detector can obtain the real abrasion condition of thegrinding groove accurately, and further determine whether to replace thegrinding wheel or to switch the grinding groove.

Step S200 is to adjust the position of the grinding wheel.

In this step, it can be determined whether the grinding groove canfurther operate, according to the abrasion condition of the grindinggroove detected by the grinding groove abrasion detector, and if not,then the grinding groove may be switched, or the grinding wheel may bereplaced, and after the grinding groove is switched, or the grindingwheel is replaced, the position of the grinding wheel can be adjusted inthe process as described above of adjusting the position of the grindingwheel.

In summary, this method can detect the real operating condition andabrasion condition of the grinding groove, and can switch the grindinggroove, or replace the grinding wheel according to the detected abrasioncondition to thereby better guarantee a stable quality of grinding. Inthis way, this method can improve the precision of grinding, and thequality of a ground product.

As described above, due to the problems in the related art of a longperiod of time for replacing a grinding wheel, a poor quality ofgrinding shortly after the grinding wheel is replaced, etc., in theembodiments of the disclosure, as illustrated in FIG. 11, after thepiece to be grounded is grounded by the grinding wheel as describedabove, the method can further include the following step.

Step S400 is to replace the grinding wheel.

In this step, the grinding wheel is replaced, and the position of thegrinding wheel can be adjusted as described above after the grindingwheel is replaced. In this way, in this method, after the grinding wheelis replaced, the operating position of the replaced grinding wheel canbe adjusted rapidly and precisely based upon the standard position ofthe grinding wheel, and the first reference position, both of which arepreviously recorded, to thereby improve the activation ratio of thegrinding device, and the quality of a ground product, and prolong theservice lifetime of the grinding wheel.

In the embodiments of the disclosure, the grinding wheel can be agrinding wheel for grinding a liquid crystal display panel and anorganic light-emitting display panel. In this way, the display panel canbe better ground by the grinding wheel to thereby improve the productquality of the display panel.

In summary, in the grinding method using a grinding device according tothe embodiments of the disclosure, the operating position of thegrinding wheel can be determined rapidly and accurately after thegrinding wheel is replaced or deformed (e.g., contracted inward),thereby improve the activation ratio of the grinding device, and thequality of a ground product, and prolong the service lifetime of thegrinding wheel.

In another aspect of the disclosure, embodiments of the disclosureprovide a grinding device. In the embodiments of the disclosure, thegrinding device can grind a piece to be ground, using the methodaccording to any one of the embodiments above of the disclosure.Accordingly this grinding device has all the features and advantages ofthe grinding method using a grinding device according to any one of theembodiments above of the disclosure, so a repeated description thereofwill be omitted here. In general, the production efficiency of thegrinding device is high, and the performance of a product produced bythe grinding device is high.

In still another aspect of the disclosure, embodiments of the disclosureprovide grinding device, where the grinding device comprises: a grindingwheel comprising a grinding groove around an outer edge of the grindingwheel, wherein the grinding wheel is configured to rotate around arotation shaft for grinding; a sample stage on one side of the rotationshaft for placing thereon a piece to be ground; and a position detectorconfigured to detect a position of a bottom of the grinding groove; thedisplay grinding device further comprises at least one processor and amemory, wherein the memory is configured to store readable programcodes, and the at least one processor is configured to execute thereadable program codes to perform the grinding method above.

In yet another aspect of the disclosure, embodiments of the disclosureprovide a grinding device. In the embodiments of the disclosure, thegrinding device includes a grinding wheel, a sample stage, and aposition adjustor, where the grinding wheel includes a grinding groovearound an outer edge of the grinding wheel, and the grinding wheel andthe grinding groove can rotate around a rotation shaft for grinding; thesample stage for placing thereon a piece to be ground is on one side ofthe rotation shaft; and the position detector is configured to detect aposition of a bottom of the grinding groove, and to adjust the positionof the grinding wheel using the method according to any one of theembodiments above of the disclosure. Accordingly this grinding devicehas all the features and advantages of the grinding method using agrinding device according to any one of the embodiments above of thedisclosure, so a repeated description thereof will be omitted here. Ingeneral, the production efficiency of the grinding device is high, andthe performance of a product produced by the grinding device is high.

In the description of the disclosure, the orientation or positionalrelationships indicated by the terms “outer”, “above”, “below”, etc.,are orientation or positional relationships as illustrated in thedrawings only for the sake of a convenient description of thedisclosure, but this shall not require any specific orientationconstruction or operation indispensable to the disclosure, so thedisclosure will not be limited thereto.

In the description of this specification reference to the terms “anembodiment”, “another embodiment”, etc., refers to that particularfeatures, structures, materials, or characteristics described inconnection with the embodiments is included in at least one embodimentsof the disclosure. In this specification, any schematic expression ofthe terms above may not refer to the same embodiment or example.Furthermore the particular features, structures, materials, orcharacteristics as described can be combined as appropriate in any oneor more embodiments or examples. Moreover the different embodiments orexamples described in the disclosure, and the features in the differentembodiments or examples can be combined with each other by those skilledin the art unless they conflict with each other. It shall be furthernoted that in this specification, the terms “first”, “second”, etc., areonly intended to refer to specific features, but not intended to requireor suggest their importance relative to each other, or to imply thenumber of indicated technical features.

Although the embodiments of the disclosure have been illustrated anddescribed above, it can be appreciated that the embodiments above areexemplary, but not intended to limit the disclosure thereto, and thoseordinarily skilled in the art can make changes, modifications,alternatives, and variations thereto.

1. A grinding method using a grinding device, wherein the grindingdevice comprises: a grinding wheel comprising a grinding groove aroundan outer edge of the grinding wheel, wherein the grinding wheel isconfigured to rotate around a rotation shaft for grinding; a samplestage on one side of the rotation shaft for placing thereon a piece tobe ground; and a position detector configured to detect a position of abottom of the grinding groove; and the method comprises: moving thegrinding wheel toward the sample stage, and recording a position of thegrinding wheel when the bottom of the grinding groove comes into contactwith the piece to be ground as a standard position; moving the grindingwheel toward the position detector, and recording a position of thegrinding wheel when a position of the bottom of the grinding groovecoincides with a detecting center of the position detector as a firstreference position; moving the grinding wheel back to the standardposition, and grinding the piece to be ground, according to a presetgrinding amount using the grinding wheel; and adjusting the position ofthe grinding wheel by: moving the grinding wheel again toward theposition detector, recording a position of the grinding wheel when aposition of the bottom of the grinding groove coincides with thedetecting center of the position detector as a second referenceposition, and adjusting the standard position based upon the firstreference position and the second reference position to therebydetermine a position of the grinding wheel.
 2. The method according toclaim 1, wherein the method further comprises: adjusting the position ofthe grinding wheel after one piece to be ground is ground using thegrinding wheel.
 3. The method according to claim 1, wherein the methodfurther comprises: adjusting the position of the grinding wheel afterthe grinding wheel is replaced, or the grinding groove is switched. 4.The method according to claim 1, wherein the method further comprises:moving the grinding wheel in a first direction; wherein the firstdirection is perpendicular to the rotation shaft, and a detectingdirection of the position detector is perpendicular to a plane definedby the rotation shaft and the first direction.
 5. The method accordingto claim 4, wherein the grinding device further comprises a grindinggroove abrasion detector configured to determine an abrasion conditionof the grinding groove by observing the bottom of the grinding groove;and after the piece to be ground is ground using the grinding wheel, themethod further comprises: detecting the abrasion condition of thegrinding groove using the grinding groove abrasion detector; determiningwhether to switch the grinding groove, or to replace the grinding wheel,according to the abrasion condition of the grinding groove; andadjusting the position of the grinding wheel after switching thegrinding groove or replacing the grinding wheel.
 6. The method accordingto claim 4, wherein the standard position is determined by: moving thegrinding wheel to a position that an outer edge of the grinding groovecomes into contact with an edge of the sample stage, and recording theposition of the grinding wheel as a first position; firstly moving thegrinding wheel from the first position by a distance X₀ away from thepiece to be ground, in the first direction, and then placing the pieceto be ground, on the sample stage, wherein an edge of the piece to beground, protrudes by the distance X₀ beyond the edge of the sample stagetoward the grinding wheel; presetting a standard value of grindingamount X₁ of the piece to be ground, in the first direction, and movingthe grinding wheel by the standard value X₁ toward the piece to beground, in the first direction; moving the grinding wheel by a value X₂toward the piece to be ground, wherein X₂ is a value of a depth by whichthe grinding groove is recessed in the first direction; and placing thepiece to be ground, on the sample stage, and adjusting the position ofthe grinding wheel based a positional displacement X₃ of the piece to beground, in the first direction.
 7. The method according to claim 6,wherein the positional displacement X₃ is determined by: correcting aposition of the piece to be ground, which is placed on the sample stage,and determining a difference between the position of the placed piece tobe ground and a preset position of the piece to be ground as thepositional displacement X₃.
 8. The method according to claim 4, whereinthe position of the grinding wheel comprises a positional coordinate Xin the first direction, and a positional coordinate Z in a seconddirection, wherein the first direction is perpendicular to the seconddirection, the rotation shaft extends in the second direction, and whenthe position of the grinding wheel is adjusted, a difference between thesecond reference position and the first reference position is areference position variation comprising a first reference positionvariation X_(m) in the first direction, and, and a second referenceposition variation Z_(m) in the second direction.
 9. The methodaccording to claim 8, wherein the adjusting the position of the grindingwheel further comprises: moving the grinding wheel to the standardposition; and moving the grinding wheel from the standard position bythe distance X_(m) in the first direction, and moving the grinding wheelfrom the standard position by the distance Z_(m) in the seconddirection.
 10. The method according to claim 6, wherein the distance X₀by which the edge of the piece to be ground protrudes beyond the edge ofthe sample stage is from 6 mm to 15 mm.
 11. A grinding device, whereinthe grinding device comprises: a grinding wheel comprising a grindinggroove around an outer edge of the grinding wheel, wherein the grindingwheel is configured to rotate around a rotation shaft for grinding; asample stage on one side of the rotation shaft for placing thereon apiece to be ground; and a position detector configured to detect aposition of a bottom of the grinding groove; the display grinding devicefurther comprises at least one processor and a memory, wherein thememory is configured to store readable program codes, and the at leastone processor is configured to execute the readable program codes to:move the grinding wheel toward the sample stage, and record a positionof the grinding wheel when the bottom of the grinding groove comes intocontact with the piece to be ground as a standard position; move thegrinding wheel toward the position detector, and record a position ofthe grinding wheel when a position of the bottom of the grinding groovecoincides with a detecting center of the position detector as a firstreference position; move the grinding wheel back to the standardposition, and grind the piece to be ground, according to a presetgrinding amount using the grinding wheel; and adjust the position of thegrinding wheel by: move the grinding wheel again toward the positiondetector, record a position of the grinding wheel when a position of thebottom of the grinding groove coincides with the detecting center of theposition detector as a second reference position, and adjust thestandard position based upon the first reference position and the secondreference position to thereby determine a position of the grindingwheel.
 12. The device according to claim 11, wherein the at least oneprocessor is further configured to execute the readable program codesto: adjust the position of the grinding wheel after one piece to beground is ground using the grinding wheel.
 13. The device according toclaim 11, wherein the at least one processor is further configured toexecute the readable program codes to: adjust the position of thegrinding wheel after the grinding wheel is replaced, or the grindinggroove is switched.
 14. The device according to claim 11, wherein the atleast one processor is further configured to execute the readableprogram codes to: move the grinding wheel in a first direction; whereinthe first direction is perpendicular to the rotation shaft, and adetecting direction of the position detector is perpendicular to a planedefined by the rotation shaft and the first direction; and wherein theposition of the grinding wheel comprises a positional coordinate X inthe first direction, and a positional coordinate Z in a seconddirection, wherein the first direction is perpendicular to the seconddirection, the rotation shaft extends in the second direction, and whenthe position of the grinding wheel is adjusted, a difference between thesecond reference position and the first reference position is areference position variation comprising a first reference positionvariation X_(m) in the first direction, and, and a second referenceposition variation Z_(m) in the second direction.
 15. The deviceaccording to claim 14, wherein the grinding device further comprises agrinding groove abrasion detector configured to determine an abrasioncondition of the grinding groove by observing the bottom of the grindinggroove; and after the piece to be ground is ground using the grindingwheel, the at least one processor is further configured to execute thereadable program codes to: detect the abrasion condition of the grindinggroove using the grinding groove abrasion detector; determine whether toswitch the grinding groove, or to replace the grinding wheel, accordingto the abrasion condition of the grinding groove; and adjust theposition of the grinding wheel after switching the grinding groove orreplacing the grinding wheel.
 16. The device according to claim 14,wherein the at least one processor is further configured to execute thereadable program codes to: move the grinding wheel to a position that anouter edge of the grinding groove comes into contact with an edge of thesample stage, and recording the position of the grinding wheel as afirst position; firstly move the grinding wheel from the first positionby a distance X₀ away from the piece to be ground, in the firstdirection, and then place the piece to be ground, on the sample stage,wherein an edge of the piece to be ground, protrudes by the distance X₀beyond the edge of the sample stage toward the grinding wheel; preset astandard value of grinding amount X₁ of the piece to be ground, in thefirst direction, and move the grinding wheel by the standard value X₁toward the piece to be ground, in the first direction; move the grindingwheel by a value X₂ toward the piece to be ground, wherein X₂ is a valueof a depth by which the grinding groove is recessed in the firstdirection; and place the piece to be ground, on the sample stage, andadjust the position of the grinding wheel based a positionaldisplacement X₃ of the piece to be ground, in the first direction. 17.The device according to claim 16, wherein the at least one processor isfurther configured to execute the readable program codes to: correct aposition of the piece to be ground, which is placed on the sample stage,and determine a difference between the position of the placed piece tobe ground and a preset position of the piece to be ground as thepositional displacement X₃.
 18. The device according to claim 14,wherein the at least one processor is further configured to execute thereadable program codes to: move the grinding wheel to the standardposition; and move the grinding wheel from the standard position by thedistance X_(m) in the first direction, and move the grinding wheel fromthe standard position by the distance Z_(m) in the second direction. 19.The device according to claim 16, wherein the at least one processor isfurther configured to execute the readable program codes to controlthat: the distance X₀ by which the edge of the piece to be groundprotrudes beyond the edge of the sample stage is from 6 mm to 15 mm. 20.A grinding device, comprising: a grinding wheel comprising a grindinggroove around the outer edge of the grinding wheel, wherein the grindingwheel is configured to rotate around the rotation shaft for grinding; asample stage on one side of the rotation shaft for placing thereon apiece to be ground; a position detector configured to detect theposition of the bottom of the grinding groove; and a position adjustorconfigured to adjust the position of the grinding wheel using the methodaccording to claim 1.